Encapsulants for Semiconductor Assembly

Henkel package-level underfills have been engineered to deliver robust performance characteristics while meeting stringent JEDEC testing requirements and enabling lead-free, low K and fine-pitch bump technology. For nearly a decade, Henkel’s thermal compression non-conductive paste (NCP) have delivered a solution for demanding end-use requirements including low warpage and low stress, extremely low K dielectrics, fine-pitch Cu pillar bump technology, tight keep out zones (KOZs)), high reliably and high adhesion.

With a wide variety of formulations from which to choose, Henkel first level underfill and NCP materials have emerged as the industry standards for flip-chip applications and are used in devices such as flip-chip CSPs and CSP-type flip-chip BGAs for processor, microprocessor, modem chip and graphic chip applications.

Formulated with superior characteristics such as fast flow and excellent adhesion, Henkel underfills and NCPs have extremely high reliability and exhibit no cracking even after thermal shock or thermal cycling testing.

Pre-Applied Non-Conductive Paste (NCP) Process

Henkel’s pre-applied non-conductive paste (NCP) underfill using a thermal compression bonding process was developed to achieve extremely low-K dielectrics with fine-pitch Cu pillar bump flip-chip technology. Our first-level underfill continues to lead the market in device protection for processes that employ a conventional reflow process.

Henkel pre-applied NCP provides a streamlined, simple process as compared to a conventional C4 capillary underfill process.

Resources for Semiconductor Encapsulants

Brochure: Wirebond Packaging