BERGQUIST® GAP PAD® TGP 5000
Známé jako Gap Pad® 5000S35
Vlastnosti a výhody
This thermally conductive, silicone-based, fibreglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD® TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fibreglass to protect against punctures, and with improved shear and tear resistance and natural tack on both sides, this product is easy to handle and ideal for high-performance applications at low mounting pressures.
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Technické informace
Barva | Světle zelená |
Dielektrická konstanta, @ 1kHz | 7.5 |
Hodnocení hořlavosti | V-0 |
Hustota | 3.6 g/cm³ |
Objemový odpor | 1×10 Ohm m |
Provozní teplota | -60.0 - 200.0 °C |
Průrazné napětí dielektrika | 5000.0 Vac |
Standardní tloušťka | 0.508 - 3.175 mm |
Tepelná kapacita, ASTM E1269 | 1.0 J/g-K |
Tepelná vodivost | 5.0 W/mK |
Tvrdost v jednotce shore, Thirty second delay value, ASTM D2240 Sypká pryž Shore 00 | 35.0 |