LOCTITE® ECCOBOND DS 3318BLX

Features and Benefits

LOCTITE ECCOBOND DS 3318BLX, Acrylic, Sealant, Encapsulation
LOCTITE® ECCOBOND DS 3318BLX fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules. Flexibility is a key characteristic of this material, enabling stress absorption and providing extra protection from cracking in functional testing.
  • High flexibility
  • Fast cure
  • Moderate modulus
  • Reworkable
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Technical Information

Applications Encapsulating
Color Blue
Cure type UV cure
Elongation, at break 250.0 %
Glass transition temperature (Tg) 68.0 °C
Storage modulus, @ 25.0 °C 510.0 MPa
Storage temperature 25.0 °C
Viscosity, Cone 20 mm, Angle 2° @ 25.0 °C Spindle TA, Shear Rate 15 s⁻¹ 2050.0 mPa·s (cP)