LOCTITE® ECCOBOND DS 3318BLX
Features and Benefits
LOCTITE ECCOBOND DS 3318BLX, Acrylic, Sealant, Encapsulation
LOCTITE® ECCOBOND DS 3318BLX fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules. Flexibility is a key characteristic of this material, enabling stress absorption and providing extra protection from cracking in functional testing.
- High flexibility
- Fast cure
- Moderate modulus
- Reworkable
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Technical Information
| Applications | Encapsulating |
| Color | Blue |
| Cure type | UV cure |
| Elongation, at break | 250.0 % |
| Glass transition temperature (Tg) | 68.0 °C |
| Storage modulus, @ 25.0 °C | 510.0 MPa |
| Storage temperature | 25.0 °C |
| Viscosity, Cone 20 mm, Angle 2° @ 25.0 °C Spindle TA, Shear Rate 15 s⁻¹ | 2050.0 mPa·s (cP) |
LOCTITE® ECCOBOND DS 3318BLX
LOCTITE ECCOBOND DS 3318BLX, Acrylic, Sealant, Encapsulation