BERGQUIST® LIQUI FORM TLF 6000HG
Features and Benefits
This 1-part, gray, silicone-based, fully cured thermal interface gel is specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.
BERGQUIST® LIQUI FORM TLF 6000HG is an award-winning, thermally conductive, dispensable, highly conformable thermal interface gel that provides electronic component thermal management capability within remote antennas and 5G base stations. It is ideal for filling larger gaps that measure up to 3.0 mm (0.11"), delivering robust vertical gap stability.
- Dispensable pre-cured: requires no mixing or refrigeration
- Thermal conductivity: 6.0 W/m-K
- Stable viscosity in storage and in the application
- Excellent chemical stability and mechanical stability
- Low compression set to reduce stress on components
Documents and Downloads
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Additional Documents
Technical Information
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Shelf life, @ 25.0 | 365.0 day |
| Thermal conductivity | 6.0 W/mK |
BERGQUIST® LIQUI FORM TLF 6000HG
This 1-part, gray, silicone-based, fully cured thermal interface gel is specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.