BERGQUIST® GAP FILLER TGF 3500LVO
Known as Gap Filler 3500LV
Features and Benefits
This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers low volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 3500LVO is a 3.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). Its ultra-conformity and low volatility make it the ideal solution for use in medical electronics and other fragile or low stress assemblies, such as optics and automotive in-cabin electronics. The mixed system provides infinite thickness variations without adding extra stress to components, and will cure at room temperature or faster with the addition of heat.
- Thermal conductivity: 3.5 W/m-K
- 100% solids with no additional cure by-products
- Low volatility for outgassing and silicone sensitive applications
- Ultra-conforming, with excellent wet-out for low stress interface applications
- For information on our thermal management materials' UL certifications, please refer to UL file E59150
Documents and Downloads
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Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 3.5 W/mK |
| Mixed | |
| Color, Mixed | Light blue |
| Resin | |
| Color, Resin | Blue |
| Hardener | |
| Color, Hardener | White |
BERGQUIST® GAP FILLER TGF 3500LVO
This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers low volatile outgassing for silicone sensitive applications.