BERGQUIST® GAP PAD® TGP 5000
Connu sous le nom de Gap Pad® 5000S35
Caractéristiques et avantages
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD® TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures.
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Informations techniques
| Capacité thermique, ASTM E1269 | 1.0 J/g-K |
| Conductivité thermique | 5.0 W/mK |
| Constante diélectrique, @ 1kHz | 7.5 |
| Cote d'inflammabilité | V-0 |
| Couleur | Vert clair |
| Densité | 3.6 g/cm³ |
| Dureté Shore, Thirty second delay value, ASTM D2240 Caoutchouc en vrac Shore 00 | 35.0 |
| Résistivité volume | 1×10 Ohm m |
| Température de service | -60.0 - 200.0 °C |
| Tension de rupture diélectrique | 5000.0 Vac |
| Épaisseur standard | 0.508 - 3.175 mm |
BERGQUIST® GAP PAD® TGP 5000
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.