BERGQUIST® LIQUI BOND TLB SA3500

Conhecido como Liqui-Bond® SA 3505

Características e Benefícios

This 2-part, liquid silicone adhesive is designed to offer high bond strength and thermal conductivity in extreme environments.
BERGQUIST® LIQUI BOND TLB SA3500 is a thermally conductive, high-performance adhesive material that, after mixing, begins to cure at room temperature and can be accelerated with heat. Once cured, this product maintains an excellent structural bond, which can withstand severe environmental conditions and eliminates the need for mechanical fasteners. The mild elastic properties of the product assist in relieving coefficient of thermal expansion (CTE) stresses during thermal cycling.
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Informação Técnica

Condutividade térmica 3.5 W/mK
Temperatura de operação -60.0 - 200.0 °C
Tipo de cura Cura por Calor
Validade da folha, @ 25.0 °C 6.0 mês