LOCTITE® ECCOBOND EN 3839
Features and Benefits
slide 1 of 1
LOCTITE ECCOBOND EN 3839, Acrylic, Encapsulant, Glob top
LOCTITE® ECCOBOND EN 3839 is specially designed for encapsulating components on PCB applications. When cured, this material provides physical protection, as well as, protection in temperature/humidity/bias testing.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
Applications | Encapsulating |
Coefficient of thermal expansion (CTE), Above Tg | 211.0 ppm/°C |
Coefficient of thermal expansion (CTE), Below Tg | 108.0 ppm/°C |
Color | Light blue |
Cure schedule light intensity | 2000.0 mJ/cm² |
Cure schedule, @ 130.0 °C | 10.0 min. |
Cure type | UV cure |
Glass transition temperature (Tg) | 26.0 °C |
Shelf life | 180.0 day |
Shore hardness, Shore D | 27.0 |
Storage modulus, DMA @ 25.0 °C | 334.0 N/mm² (48400.0 psi ) |
Storage temperature | -20.0 °C |
Thixotropic index | 4.1 |
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 7800.0 mPa·s (cP) |