MSL and Board-Level Exposed Pad Performance
Recent recalls in the automotive industry have reinforced the need for components with higher reliability. Applications such as air bag sensors and electronic system have underscored the importance of high levels of reliability for automotive customers.
The JEDEC JESD22- A104D Temperature Cycle Standard is just one such example where the automotive industry is using severe reliability testing requirements. This article will focus on reliability testing for conductive Die Attach Film (cDAF) technology, specifically die applications ranging from 1x1 mm2 to 10x10 mm2. Our test results are showing zero delamination after Moisture Sensitivity Level 1 (MSL 1) with more than 2000 exposed pad board-level temperature cycles. When compared to die attach paste with similar product characteristics, cDAF technology is outperforming MSL 1 and temp cycle results.